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1

Bromine- and chlorine-induced degradation of gold-aluminum bonds

Min-Hsien Lue, Chen-Town Huang, Sheng-Tzung Huang, Ker-Chang Hsieh

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 2.75 MB

english, 2004

2

Corrosion behavior of pure tin deposit under 55

Yeh, Min-Chi, Li, Jyun Lin, Lo, Pei Jen, Yu, Rick, Yu, Cheng-Fu, Hsieh, Ker-Chang

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 628 KB

english, 2014

3

A Thermodynamic description and phase relationships of the FeCr system: Part II the liquid phase and the fcc phase

Lin, Jen-Chwen, Chuang, Ying-Yu, Hsieh, Ker-Chang, Chang, Y.Austin

Journal:

Year:

1987

Language:

english

File:

PDF, 649 KB

english, 1987

4

Who Plays Games Online?

Teng, Ching-I, Jeng, Shih-Ping, Chang, Henry Ker-Chang, Wu, Soushan

Journal:

International Journal of E-Business Research

Year:

2012

Language:

english

File:

PDF, 259 KB

english, 2012

5

Cu wire bond microstructure analysis and failure mechanism

Cheng-Fu Yu, Chi-Ming Chan, Li-Chun Chan, Ker-Chang Hsieh

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1020 KB

english, 2011

6

The effect of tin grain structure on whisker growth

Cheng-Fu Yu, Chi-Ming Chan, Ker-Chang Hsieh

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.90 MB

english, 2010

7

The microstructure of η′-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth

Kuang-Kuo Wang, Dershin Gan, Ker-Chang Hsieh, Shi-Yung Chiou

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 701 KB

english, 2010

8

Orientation relationships, interfaces, and microstructure of η-Cu6Sn5 formed in the early-stage reaction between Cu and molten Sn

Kuang-Kuo Wang, Dershin Gan, Ker-Chang Hsieh

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 3.75 MB

english, 2010

9

Ag and Cu migration phenomena on wire-bonding

Ker-Chang Hsieh, Theo Martens

Journal:

Journal of Electronic Materials

Year:

2000

Language:

english

File:

PDF, 220 KB

english, 2000

10

Intermetallic growth of wire-bond at 175°C high temperature aging

Hen-So Chang, J. X. Pon, Ker-Chang Hsieh, C. C. Chen

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 6.78 MB

english, 2001

11

The effect of Pd and Cu in the intermetallic growth of alloy Au wire

Hen-So Chang, Ker-Chang Hsieh, Theo Martens, Albert Yang

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 977 KB

english, 2003

12

A linear quadtree compression scheme for image encryption

Henry Ker-Chang Chang, Jiang-Long Liu

Journal:

Signal Processing: Image Communication

Year:

1997

Language:

english

File:

PDF, 1018 KB

english, 1997

13

A breadth-first quadtree coding scheme for multicolored spatial data

Henry Ker-Chang Chang, Cheng-Kuan Tso

Journal:

Computers & Geosciences

Year:

1996

Language:

english

File:

PDF, 900 KB

english, 1996

14

The microstructure and phase equilibrium of new high performance high-entropy alloys

Ker-Chang Hsieh, Cheng-Fu Yu, Wen-Tai Hsieh, Wei-Ren Chiang, Jin Son Ku, Jiun-Hui Lai, Chin-Pan Tu, Chih Chao Yang

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 1.08 MB

english, 2009

15

The orientation relationships of the Cu3Sn/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5

Wang, Kuang-Kuo, Gan, Dershin, Hsieh, Ker-Chang

Journal:

Thin Solid Films

Year:

2014

Language:

english

File:

PDF, 729 KB

english, 2014

16

Fight evaluation and managerial efficiency evaluation of NFL teams

Chen, Ker-Chang, Huang, Li-Fei, Hung, Chin-Yuan, Chen, Yu-Chi, Wu, Hui-Ting, Huang, Wei-Kai

Journal:

Journal of Statistics and Management Systems

Year:

2010

Language:

english

File:

PDF, 467 KB

english, 2010

17

Thermochemical Description of the Ternary Iron-Nickel-Sulfur System

Hsieh, Ker-Chang, Austin Chang, Y.

Journal:

Canadian Metallurgical Quarterly

Year:

1987

Language:

english

File:

PDF, 1.48 MB

english, 1987

18

Solving Scalability Problems on Secure RFID Grouping-Proof Protocol

Hsi, Cheng-Ter, Lien, Yuan-Hung, Chiu, Jung-Hui, Chang, Henry Ker-Chang

Journal:

Wireless Personal Communications

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

19

Nano-structure to Laves phase: Reduced Thermal Conductivity from Medium-Entropy AlNbV to High-Entropy AlNbVCrTi Alloys

Jhong, Meng-Jie, Jen, I-Lun, Wang, Kuang-Kuo, Yen, Wan-Ting, Huang, Jacob C., Jang, Jason S.-C., Hsieh, Ker-Chang, Wu, Hsin-Jay

Journal:

Year:

2020

File:

PDF, 5.26 MB

2020

20

Designing Ductile Zr-Based Bulk Metallic Glasses with Phase Separated Microstructure

Xinghao Du, Jacob C. Huang, Ker-Chang Hsieh, Jason S. C. Jang, Peter K. Liaw, Hai-Ming Chen, Hung-Sheng Chou, Yan-Huei Lai

Journal:

Advanced Engineering Materials

Year:

2009

Language:

english

File:

PDF, 539 KB

english, 2009

21

Stoichiometric control of CuInSe2 thin films using a molecular beam epitaxy technique

Bae-Heng Tseng, Song-Bin Lin, Ker-Chang Hsieh, Huey-Liang Hwang

Journal:

Journal of Crystal Growth

Year:

1995

Language:

english

File:

PDF, 392 KB

english, 1995

22

Computational thermodynamics to identify Zr–Ti–Ni–Cu–Al alloys with high glass-forming ability

Hongbo Cao, Dong Ma, Ker-Chang Hsieh, Ling Ding, William G. Stratton, Paul M. Voyles, Ye Pan, Mingdong Cai, J. Thomas Dickinson, Y. Austin Chang

Journal:

Acta Materialia

Year:

2006

Language:

english

File:

PDF, 538 KB

english, 2006

23

Synthesis of copper-rich amorphous alloys by computational thermodynamics

Hongbo Cao, Ye Pan, Ling Ding, Chuan Zhang, Jun Zhu, Ker-Chang Hsieh, Y. Austin Chang

Journal:

Acta Materialia

Year:

2008

Language:

english

File:

PDF, 379 KB

english, 2008

24

ID-based threshold digital signature schemes on the elliptic curve discrete logarithm problem

Pin-Chang Su, Henry Ker-Chang Chang, Erl-Huei Lu

Journal:

Applied Mathematics and Computation

Year:

2005

Language:

english

File:

PDF, 237 KB

english, 2005

25

A knapsack public-key cryptosystem based on elliptic curve discrete logarithm

Pin-Chang Su, Erl-Huei Lu, Henry Ker-Chang Chang

Journal:

Applied Mathematics and Computation

Year:

2005

Language:

english

File:

PDF, 183 KB

english, 2005

26

Design of traceable security system

Henry Ker-Chang Chang, Erl-Huei Lu, Pin-Chang Su

Journal:

Applied Mathematics and Computation

Year:

2005

Language:

english

File:

PDF, 254 KB

english, 2005

27

Fail-stop blind signature scheme design based on pairings

Henry Ker-Chang Chang, Erl-Huei Lu, Pin-Chang Su

Journal:

Applied Mathematics and Computation

Year:

2005

Language:

english

File:

PDF, 112 KB

english, 2005

28

A novel access control method using Morton number and prime factorization

Henry Ker-Chang Chang, Jing-Jang Hwang, Hsing-Hua Liu

Journal:

Information Sciences

Year:

2000

Language:

english

File:

PDF, 459 KB

english, 2000

29

Erratum

Ker-Chang Hsieh, Ming-Yuan Kao, Y. Austin Chang

Journal:

Oxidation of Metals

Year:

1988

Language:

english

File:

PDF, 89 KB

english, 1988

30

The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad

Shih-Chang Chang, Sheng-Chih Lin, Ker-Chang Hsieh

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 577 KB

english, 2006

31

An RFID Based Multi-batch Supply Chain Systems

Yuan-Hung Lien, Cheng-Ter Hsi, Xuefei Leng, Jung-Hui Chiu, Henry Ker-Chang Chang

Journal:

Wireless Personal Communications

Year:

2012

Language:

english

File:

PDF, 1.06 MB

english, 2012

32

Interfacial microstructure of Pb-free and Pb-Sn solder balls in the ball-grid array package

Chin-Su Chi, Hen-So Chang, Ker-Chang Hsieh, C. L. Chung

Journal:

Journal of Electronic Materials

Year:

2002

Language:

english

File:

PDF, 2.20 MB

english, 2002

33

Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness

Min-Hsien Lu, Ker-Chang Hsieh

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 713 KB

english, 2007

34

The Mechanism of Residual Stress Relief for Various Tin Grain Structures

Cheng-Fu Yu, Ker-Chang Hsieh

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 417 KB

english, 2010

35

A parallel algorithm for the knapsack problem using a generation and searching technique

Henry Ker-Chang Chang, Jonathan Jen-Rong Chen, Shyong-Jian Shyu

Journal:

Parallel Computing

Year:

1994

Language:

english

File:

PDF, 595 KB

english, 1994

36

A thermodynamic analysis of the phase equilibria of the Fe-Ni system above 1200 K

Ying-Yu Chuang, Ker-Chang Hsieh, Y.Austin Chang

Journal:

Metallurgical and Materials Transactions A

Year:

1986

Language:

english

File:

PDF, 741 KB

english, 1986

37

A solid-state emf study of the Cu-Cu2O-NiO three-phase equilibrium

Yong-Zoo You, Ker-Chang Hsieh, Y.Austin Chang

Journal:

Metallurgical and Materials Transactions A

Year:

1986

Language:

english

File:

PDF, 266 KB

english, 1986

38

A solid-state emf study of ternary Ni-S-O, Fe-S-O, and quaternary Fe-Ni-S-O

Ker-Chang Hsieh, Y. Austin Chang

Journal:

Metallurgical and Materials Transactions B

Year:

1986

Language:

english

File:

PDF, 1.16 MB

english, 1986

39

The Fe−Ni−S system above 700°C (Iron−Nickel−Sulfur)

Ker-Chang Hsieh, Y. Austin Chang, Tianju Zhong

Journal:

Journal of Phase Equilibria

Year:

1982

Language:

english

File:

PDF, 459 KB

english, 1982

40

Oxygen potentials and phase equilibria of the quaternary Y-Ba-Cu-O system in the region involving the YBa2Cu3O7−x phase

Krzysztof Fitzner, Omran Musbah, Hsieh Ker-Chang, Zhang Min-xian, Y.Austin Chang

Journal:

Materials Chemistry and Physics

Year:

1993

Language:

english

File:

PDF, 657 KB

english, 1993

41

Thermodynamic properties and phase equilibria of Sn–Bi–Zn ternary alloys

Ching-feng Yang, Feng-ling Chen, Wojciech Gierlotka, Sinn-wen Chen, Ker-chang Hsieh, Li-ling Huang

Journal:

Materials Chemistry and Physics

Year:

2008

Language:

english

File:

PDF, 1.93 MB

english, 2008

42

Selection and characterization of lipase abzyme from phage displayed antibody libraries

Max K. Leong, Chinpiao Chen, Ker-Chang Shar, David Shiuan

Journal:

Biochemical and Biophysical Research Communications

Year:

2007

Language:

english

File:

PDF, 928 KB

english, 2007

43

Phase equilibrium in the Cu–Ni–Zr system at 800 °C

Chih-Hua Liu, Wei-Ren Chiang, Ker-Chang Hsieh, Y. Austin Chang

Journal:

Year:

2006

Language:

english

File:

PDF, 282 KB

english, 2006

44

Phase reaction in Sn–9Zn solder with Ni/Au surface finish bond-pad at 175 °C ageing

Shih-Chang Chang, Sheng-Chih Lin, Ker-Chang Hsieh

Journal:

Journal of Alloys and Compounds

Year:

2007

Language:

english

File:

PDF, 1.19 MB

english, 2007

45

The comparison of rDNA spacer regions of Nosema ceranae isolates from different hosts and locations

Wei-Fone Huang, Michel Bocquet, Ker-Chang Lee, I-Hsin Sung, Jing-Hao Jiang, Yue-Wen Chen, Chung-Hsiung Wang

Journal:

Journal of Invertebrate Pathology

Year:

2008

Language:

english

File:

PDF, 329 KB

english, 2008

46

Thermodynamic and structural parameters of the body-center tetragonal TiAl phase

Ker-Chang Hsieh, Y. Austin Chang

Journal:

Scripta Metallurgica

Year:

1988

Language:

english

File:

PDF, 246 KB

english, 1988

47

Extension of the associated solution model to ternary metal-sulfur melts: NiCoS at 1,273 K

Ying-Yu, Chuang, Ker-Chang, Hsieh, Austin Chang, Y.

Journal:

Year:

1981

Language:

english

File:

PDF, 673 KB

english, 1981

48

A New EPC RFID Protocol Revised from Yehet al. Protocol

Lin, Hardy, Chen, Yu-Kai, Chang, Henry Ker-Chang

Journal:

Year:

2013

Language:

english

File:

PDF, 2.11 MB

english, 2013

49

Phase Equilibrium in the Ni-Ti-Zr System at 800

Yeh, Min-Chi, Li, Jyun Lin, Lo, Pei Jen, Hsieh, Ker-Chang

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2014

Language:

english

File:

PDF, 504 KB

english, 2014

50

[IEEE Proceedings 39th Annual 2005 International Carnahan Conference on Security Technology - Las Palmas, Spain (2005.10.11-2005.10.14)] Proceedings 39th Annual 2005 International Carnahan Conference on Security Technology - Secured key exchange protocol in wireless mobile ad hoc networks

Shu-Hwang Liaw,, Pin-Chang Su,, Henry Ker-Chang Chang,, Erl-Huei Lu,, Shun-Fu Pon,

Year:

2005

Language:

english

File:

PDF, 2.25 MB

english, 2005